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CMP Research
Current Research Projects

From DELIF pictures of the slurry layer in CMP we are able to infer pad and wafer topography. My master's thesis will explored how the polishing pad topography changes near micron sized wafer features. My PhD thesis explores using DELIF to determine pad-wafer contact.
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  I'm interested in the thin film of slurry that lies between the wafer and the polishing pad. Its an interesting fluid problem with direct industrial application. I hope to gain a quantitative and qualitative understanding of the physical processes involved.
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  CMP Research The goal of my research is to track tagged silica particles in the slurry during polishing. I am especially interested in tracking the path of the slurry around the asperities and ditches found in the pad's surface.
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  CMP Research To develop a process to thin die-level components to < 40 microns.
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Previous Research Projects

  Goal: To find the percentage of contact area between the polishing pad and silicon wafer during a CMP polish. To then find a correlation between that percent contact and the friction force between the pad and wafer.
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