| CMP
Research |
Current Research Projects
 |
 |
|
From DELIF pictures
of the slurry layer in CMP we are able to infer pad and wafer topography.
My master's thesis will explored how the polishing pad topography changes
near micron sized wafer features. My PhD thesis explores using DELIF to
determine pad-wafer contact. |
| More... |
|
 |
 |
|
|
|
|
 |
|
I'm interested in the thin film of slurry that lies between the wafer and
the polishing pad. Its an interesting fluid problem with direct industrial
application. I hope to gain a quantitative and qualitative understanding
of the physical processes involved. |
| More... |
|
|
|
|
|
|
|
 |
|
CMP Research
The goal of my research is to track tagged silica particles in the slurry
during polishing. I am especially interested in tracking the path of the
slurry around the asperities and ditches found in the pad's surface. |
| More... |
|
|
|
|
|
|
|
 |
|
CMP
Research To develop a process to thin die-level components to < 40
microns. |
| More... |
|
|
|
|
|
Previous Research Projects
|
|
 |
|
Goal:
To find the percentage of contact area between the polishing pad and silicon
wafer during a CMP polish. To then find a correlation between that percent
contact and the friction force between the pad and wafer. |
| More... |
|
|
|
|
