Investigator: Jeff Thompson

Funding:

Goal: To develop a process to thin die-level components to < 40 microns.

Procedure: The majority of material will be removed using a mechanical lapping process. Chemical Mechanical Planarization (CMP) will serve as the final stage to create a smooth, flat die.

Experimental Setup:
A Struers RotoPol-31 table top polisher unit was is fitted with a
Mitsubishi Freqrol frequency modulator that allows the platen to
rotate at speeds ranging from 20 rpm to 300 rpm. A simple
aluminum shaft is driven by the same Dayton ½ HP DC motor.
The shaft system is support by 10 series 80/20 aluminum 2”X4”
beams. A weighted lever arm is mounted on the top of the shaft
to achieve variable applied wafer pressures.

Results: TBA