Polishing Pads

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1. Modeling the Influence of Pad Bending on the Planarization Performance During CMP. J. Grillaert, M Meuris, E. Vrancken, N. Heylen, K. Devriendt, W. Fyen, and M. Heyns.
2. Structured Abrasive CMP: Length Scales, Subpads, and Planarization. D.P. Goetz.
3. CMP Fundamentals and Challenges. M. R. Oliver.
4. Evaluation of Commercialized Slurries and Pads for Polymer CMP. F. Zhangm, R. W. Wake, L. Cook, and A.A. Busnaina.
5. Mechanistic Aspects of the Relationship Between CMP Consumables and Polishing Characteristics. Y. S. Obeng, K. M. Forthoefel, K. A. Richardson, and R. H. Burton.
6. Pad Chargeability in CMP. F. Malik and M. Hason.
7. Characterizing CMP Pad Conditioning Using Diamond Abrasives. T. Dyer.
8. Optical Interferometry for Surface Measurements of CMP Pads. D. Stein, D. Hetherington, M. Dugger, T. Stout.
9. Pad Conditioning in Interlayer Dielectric CMP. I. Ali and S. R. Roy. Solid State Technology, pages 185-187, June 1997.
10. Characteristics in CMP of Copper: Comparison of Polishing Pads. Z. Stavreva, D. Zeidler, M. Plotner, and K. Drescher. Applied Surface Science, 108 pages 39-44, 1997.
11. Pad Porosity, Compressibiltity and Slurry Delivery Effects in CMP Modeling and Experiments. D. Thakurta, C. Borst, D. Schwenderman, R. Gutmann, W. Gill. Thin Solid Films, 366:181-190, 2000. View Abstract | Full Text
12. The Effect of the Polishing Pad Treatments on the CMP Polishing of SiO2 Films. W. Li, D. W. Shin, M. Tomozawa, and S. P. Murarka.
13. Variation of Polish Pad Shape During Pad Dressing. Y. Y. Zhou and E. C. Davis. Materials Science and Engineering, B68:91-98, 1999.
14. Modeling on Mechanical Properties of Polishing Pads in CMP Process. T. Nishioka, S. Iwani, T. Kawakami, Y. Tateyama, H. Ohtani, N. Miyashita.
15. Pad Conditioning and Pad Surface Characterization in Oxide Chemical Mechanical Polishing. A. S. Lawing.
16. Polish Rate, Pad Surface Morphology and Pad Conditioning in Oxide Chemical Mechanical Polishing. A. S. Lawing.
17. Pad Conditioning and Removal Rate in Oxide Chemical Mechanical Polishing. A. S. Lawing. Proceedings of the Seventh International Chemical Mechanical Planarization for (ULSI) Multilevel Interconnection Conference, Feb. 27-Mar. 1 2002.
18. The Effect of Polishing Pad Conditioning on the Planarization Capabilities of the Chemical Mechanical Polishing Process. B. Mullany, G. Byrne, and M. Power.
19. Advances in Characterization of CMP Consumables. M. Moinpour, A. Tregub, A. Oehler, and K. Cadien. MRS Bulletin, 27(10):776, Oct. 2002. View Abstract
20. The Effect of Polishing Pad Treatments on the Chemical Mechanical Polishing of SiO2. W. Li, D. W. Shin, M. Tomozawa, and S. P. Murarka. Thin Solid Films, 270:601-606, 1995. View Abstract | Full Text
21. Characteristics in Chemical Mechanical Polishing of Copper: Comparison of Polishing Pads. Z. Stavreva, D. Zeidler, M. Plotner, and K. Drescher. Applied Surface Science, 108:39-44, 1997.
22. Modeling on Mechanical Properties of Polishing Pads in CMP Process. T. Nishioka, S. Iwami, and T. Kawakami. Materials Research Society Symposium, 613:E1.5.1-E1.7.1, 2000.
23. The Effect of Pad Structuring on CMP Performance. K. Devriendt, E. Vrancken, and J. Grillaert. Proceedings of the Fourth International Chemical Mechanical Planarization for ULSI Multilevel Interconnection Conference (CMP-MIC), pages 227-233, 1999.
24. Dynamic Mechanical Analysis (DMA) of CMP Pad Materials. I. Li, K. Forsthoefel, and K. Richardson. Materials Research Symposium, 613:E7.3.1-E7.3.10, 2000.
25. Characterizing an ILD CMP Process Using Colloidal Silica Slurry to Achieve a Longer Pad Life. P. Chavez and A. Clark. CMP-MIC Conference, March 2-4, 2000.
26. A Modified Asperity Tribological Mechanism: Pad Deformation Effect on the WIWNU. C. He, C. Chiou, Y. Fann, W. Pan, and C. Hus. CMP-MIC Conference, March 7-8, 2001.
27. Pad Conditioning in Chemical Mechanical Polishing. B. J. Hooper, G. Byrne, and S. Galligan. Journal of Materials Processing Technology, 123(1):107-113, 2002.
28. Novel Open Cell Polishing of Pad Materials for Oxide CMP. H. Liang, R. Sevilla, and F. B. Kaufman. Proceedings of the Materials Research Society, 1998.
29. Pad Life Optimization by Characterization of a Fundamental Pad-Disk Interaction Property. G. Prabhu, D. Flynn, and S. Kumaraswamy. Proceedings of the Fifth International Chemical Mechanical Polish Planarization for {ULSI} Multilevel Interconnection Conference, March, 2000.
30. Dynamic Mechanical Analysis (DMA) of CMP Pad Materials. I. Li, K. M. Forsthoefel, K. A. Richardson, Y. S. Obeng, W. G. Easter, and A. Maury. Materials Research Society Proceedings, 613:E7.3, April 26-27, 2000.
31. Effect of Novel Pad Groove Designs on the Frictional and Removal Rate Characteristics of ILD CMP. D. Rosales-Yeomans, T. Doi, M. Kinoshita, and A. Philipossian. Proceedings of the 204th ECS Meeting, Orlando, FL Oct. 2003.